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  r09ds0011ej0100 rev.1.00 page 1 of 10 jan 21, 2011 data sheet NE3509M14 n-channel gaas hj-fet, l to c band low noise amplifier features ? super low noise figure and high associated gain high isolation nf = 0.4 db typ., g a = 18.5 db typ. @ v ds = 2 v, i d = 10 ma, f = 2 ghz ? 4-pin lead-less minimold (m 14, 1208 pkg) package applications ? satellite radio (sdars, dmb, dab, etc.) antenna lna ? gps antenna lna ? low noise amplifier for micr owave communication system ordering information part number order number package quantity marking supplying form NE3509M14-t3 NE3509M14-t3-a 4-pin lead-less minimold (m14, 1208 pkg) (pb-free) 10 kpcs/reel zr ? embossed tape 8 mm wide ? pin 1 (drain), pin 4 (source) face the perforation side of the tape remark to order evaluation samples, please contact your nearby sales office. part number for sample order: NE3509M14 absolute maximum ratings (t a = +25 c, unless otherwise specified) parameter symbol ratings unit drain to source voltage v ds 4.0 v gate to source voltage v gs ? 3.0 v drain current i d i dss ma gate current i g 200 a total power dissipation note p tot 150 mw channel temperature t ch +150 c storage temperature t stg ? 65 to +150 c note: mounted on 1.08 cm 2 1.0 mm (t) glass epoxy pwb caution observe precautions when handling because these devi ces are sensitive to electrostatic discharge. r09ds0011ej0100 rev.1.00 jan 21, 2011
NE3509M14 r09ds0011ej0100 rev.1.00 page 2 of 10 jan 21, 2011 recommended operating range (t a = +25 c, unless otherwise specified) parameter symbol min. typ. max. unit drain to source voltage v ds ? 2 3 v drain current i d ? 10 20 ma input power p in ? ? 0 dbm electrical characteristics (t a = +25 c, unless otherwise specified) parameter symbol test conditi ons min. typ. max. unit gate to source leak current i gso v gs = ? 3.0 v ? 0.5 10 a saturated drain current i dss v ds = 2 v, v gs = 0 v 30 45 60 ma gate to source cutoff voltage v gs (off) v ds = 2 v, i d = 50 a ? 0.25 ? 0.50 ? 0.75 v trans conductance g m v ds = 2 v, i d = 10 ma 80 ? ? ms noise figure nf ? 0.4 0.7 db associated gain g a v ds = 2 v, i d = 10 ma, f = 2 ghz 16.5 18.5 ? db standard characteristics for reference (t a = +25 c, unless otherwise specified) parameter symbol test conditions reference value unit gain 1 db compression output power p o (1 db) f = 2 ghz, v ds = 2 v, i d = 10 ma set (non-rf) +11 dbm
NE3509M14 r09ds0011ej0100 rev.1.00 page 3 of 10 jan 21, 2011 typical characteristics (t a = +25 c, unless otherwise specified) total power dissipation p tot (mw) ambient temperature t a ( c) vs. ambient temperature total power dissipation 250 200 150 100 50 0 50 100 150 200 250 mounted on glass epoxy pcb (1.08 cm 2 1.0 mm (t) ) drain current i d (ma) gate to source voltage v gs (v) drain current vs. gate to source voltage v ds = 2 v 50 45 40 35 30 25 20 15 10 5 0 ?1.0 ?0.8 ?0.6 ?0.4 ?0.2 0 drain current i d (ma) drain to source voltage v ds (v) drain to source voltage drain current vs. 100 20 40 60 80 0 12345 v gs = 0 v ? 0.2 v ? 0.3 v ? 0.1 v ? 0.4 v ? 0.5 v frequency f (ghz) minimum noise figure nf min (db) associated gain g a (db) associated gain vs. frequency minimum noise figure, 2.0 1.2 1.4 1.6 1.8 0.6 0.8 1.0 0.2 0.4 0.0 20 6 8 10 12 14 18 4 2 16 0 0 5 10 15 nf min g a v ds = 2 v i d = 10 ma drain current i d (ma) minimum noise figure nf min (db) associated gain g a (db) associated gain vs. drain current minimum noise figure, 2.0 1.2 1.4 1.6 1.8 0.6 0.8 1.0 0.2 0.4 0.0 20 6 8 10 12 14 18 4 2 16 0 0 5 10 15 20 25 30 35 40 f = 2 ghz v ds = 2 v nf min g a drain voltage v ds (v) minimum noise figure nf min (db) associated gain g a (db) associated gain vs. drain voltage minimum noise figure, 2.0 1.2 1.4 1.6 1.8 0.6 0.8 1.0 0.2 0.4 0.0 20 6 8 10 12 14 18 4 2 16 0 1.0 1.5 2.0 2.5 3.0 3.5 nf min g a f = 2 ghz, i d = 10 ma remark the graphs indicate nominal characteristics.
NE3509M14 r09ds0011ej0100 rev.1.00 page 4 of 10 jan 21, 2011 frequency f (ghz) mag, msg, k factor vs. frequency maximum available power gain mag (db) maximum stable power gain msg (db) 25 20 15 10 5 0 0 5 10 15 20 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 mag msg k factor k factor v ds = 2 v, i d = 10 ma frequency f (ghz) insertion power gain, isolation vs. frequency insertion power gain |s 21 | 2 (db) 0 ?5 ?10 ?15 ?20 ?25 isolation |s 12 | 2 (db) 25 20 15 10 5 0 0 5 10 15 20 v ds = 2 v, i d = 10 ma |s 21 | 2 |s 12 | 2 remark the graphs indicate nominal characteristics.
NE3509M14 r09ds0011ej0100 rev.1.00 page 5 of 10 jan 21, 2011 output power, g p , i d , i g vs. input power output power p out (dbm) power gain g p (db) input power p in (dbm) drain current i d (ma) gate current i g (ma) 25 20 15 10 5 0 ?5 ?10 ?15 80 70 60 50 40 30 20 10 0 p out i d ? 25 ? 20 ? 15 ? 10 ? 50 51015 i g g p f = 2 ghz, v ds = 2 v, i d = 10 ma set, p o (1 db) optimize output power, im 3 , i d , i g vs. input power output power p out (2 tone) (dbm) 3rd order intermodulation distortion im 3 (1 tone) (dbm) input power p in (2 tone) (dbm) drain current i d (ma) gate current i g (ma) 30 20 10 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 100 90 80 70 60 50 40 30 20 10 0 ? 25 ? 20 ? 15 ? 10 ? 50 51015 f1 = 2 000 mhz f2 = 2 001 mhz p out im 3 (l) im 3 (h) i d i g v ds = 2 v, i d = 10 ma set, p o (1 db) optimize remark the graphs indicate nominal characteristics.
NE3509M14 r09ds0011ej0100 rev.1.00 page 6 of 10 jan 21, 2011 s-parameters s-parameters and noise parameters are provided on our web s ite in a format (s2p) that en ables the direct import of the parameters to microwave circuit simulators without the need for keyboard inputs. click here to download s-parameters. [rf and microwave] [device parameters] url http://www2.renesas.com/microwave/en/download.html
NE3509M14 r09ds0011ej0100 rev.1.00 page 7 of 10 jan 21, 2011 mounting pad layout dimensions 4-pin lead-less mini-mold (m 14, 1208 pkg) (unit: mm) 0.8 0.8 0.45 0.25 remark the mounting pad layout in this document is for reference only.
NE3509M14 r09ds0011ej0100 rev.1.00 page 8 of 10 jan 21, 2011 package dimensions 4-pin lead-less mini-mold (m 14, 1208 pkg) (unit: mm) 0.50.05 0.11 +0.1 ?0.05 (0.6) 0.2 0.2 1.2 +0.07 ?0.05 0.8 0.8 +0.07 ?0.05 1.00.05 0.150.05 43 12 (0.1) (bottom view) remark ( ) : reference value (top view) pin connections 1. drain 2. source 3. gate 4. source zr
NE3509M14 r09ds0011ej0100 rev.1.00 page 9 of 10 jan 21, 2011 recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 c or below time at peak temperature : 10 seconds or less time at temperature of 220 c or higher : 60 seconds or less preheating time at 120 to 180 c : 120 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below ir260 partial heating peak temperature (package surface temperature) : 350 c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2% (wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).
NE3509M14 r09ds0011ej0100 rev.1.00 page 10 of 10 jan 21, 2011 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposi ng of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, tran sport and dispose of materials that contain arsenic and ot her such industrial waste materials. 2. exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subjec t to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the product or in any way allow it to enter the mouth.
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history NE3509M14 data sheet description rev. date page summary 1.00 jan 21, 2011 ? first edition issued
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is s ubject to change without any prior notice. before purchasing or using any renesas electronics products listed herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by renesas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any paten ts, copyrights or other intellectual property rights of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . 4. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this document, you should comply with the applicable export control l aws and regulations and follow the procedures required by such laws and regulations. you should not use renesas electronics products or the technology described in this document for any purpose rela ting to military applications or use by the military, including but not limited to the development of weapons of mass destruction. renesas electronics products and technology may not be used for or incorporate d into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information incl uded herein. 7. renesas electronics products are classified according to the following three quality grades: "standard", "high quality", an d "specific". the recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. you must check the quality grade of each renesas electronics produ ct before using it in a particular application. you may not use any renesas electronics product for any application categorized as "specific" without the prior written consent of renesas electronics. fu rther, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for an application categorized as "specific" or for which the product is not intended wh ere you have failed to obtain the prior written consent of renesas electronics. the quality grade of each renesas electronics product is "standard" unless otherwise expressly specified in a renesas electroni cs data sheets or data books, etc. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment ; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "specific": aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or syst ems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct thr eat to human life. 8. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas el ectronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have s pecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance design . please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics produc t, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measu res. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compati bility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, in cluding without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of renes as electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this doc ument or renesas electronics products, or if you have any other inquiries. (note 1) "renesas electronics" as used in this document means renesas electronics corporation and also includes its majority-o wned subsidiaries. (note 2) "renesas electronics product(s)" means any product developed or manufactured by or for renesas electronics. http://www.renesas.com refer to "http://www.renesas.com/" for the latest and detailed information. renesas electronics america inc. 2880 scott boulevard santa clara, ca 95050-2554, u.s.a. tel: +1-408-588-6000, fax: +1-408-588-6130 renesas electronics canada limited 1101 nicholson road, newmarket, ontario l3y 9c3, canada tel: +1-905-898-5441, fax: +1-905-898-3220 renesas electronics europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k tel: +44-1628-585-100, fax: +44-1628-585-900 renesas electronics europe gmbh arcadiastrasse 10, 40472 dsseldorf, germany tel: +49-211-65030, fax: +49-211-6503-1327 renesas electronics (china) co., ltd. 7th floor, quantum plaza, no.27 zhichunlu haidian district, beijing 100083, p.r.china tel: +86-10-8235-1155, fax: +86-10-8235-7679 renesas electronics (shanghai) co., ltd. unit 204, 205, azia center, no.1233 lujiazui ring rd., pudong district, shanghai 200120, china tel: +86-21-5877-1818, fax: +86-21-6887-7858 / -7898 renesas electronics hong kong limited unit 1601-1613, 16/f., tower 2, grand century place, 193 prince edward road west, mongkok, kowloon, hong kong tel: +852-2886-9318, fax: +852 2886-9022/9044 renesas electronics taiwan co., ltd. 7f, no. 363 fu shing north road taipei, taiwan tel: +886-2-8175-9600, fax: +886 2-8175-9670 renesas electronics singapore pte. ltd. 1 harbourfront avenue, #06-10, keppel bay tower, singapore 098632 tel: +65-6213-0200, fax: +65-6278-8001 renesas electronics malaysia sdn.bhd. unit 906, block b, menara amcorp, amcorp trade centre, no. 18, jln persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: +60-3-7955-9390, fax: +60-3-7955-9510 renesas electronics korea co., ltd. 11f., samik lavied' or bldg., 720-2 yeoksam-dong, kangnam-ku, seoul 135-080, korea tel: +82-2-558-3737, fax: +82-2-558-5141 sales offices ? 2011 renesas electronics corporation. all rights reserved. colophon 1.0


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